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The property of Si/SiGe/Si heterostructure during thermal budget characterized by HRXRD

LOW ENERGY ACCELERATOR, RAY TECHNOLOGY AND APPLICATIONS

The property of Si/SiGe/Si heterostructure during thermal budget characterized by HRXRD

CHEN Chang-Chun
LIU Zhi-Hong
HUANG Wen-Tao
DOU Wei-Zhi
ZHANG Wei
TSIEN Pei-Hsin
ZHU De-Zhang
Nuclear Science and TechniquesVol.14, No.4pp.238-241Published in print 01 Nov 2003
37002

Si/SiGe/Si heterostructures grown by ultra-high-vacuum chemical vapor deposition (UHVCVD) were characterized by Rutherford backscattering/Channeling (RBS/C) together with high resolution X ray diffraction (HRXRD). High quality SiGe base layer was obtained. The Si/SiGe/Si heterostructures were subject to conventional furnace annealing and rapid thermal annealing with temperature between 750 oC and 910 oC. Both strain and its relaxation degree in SiGe layer are calculated by HRXRD combined with elastic theory, which are never reported in other literatures. The rapid thermal annealing at elevated temperature between 880 oC and 910 oC for very short time had almost no influence on the strain in Si0.84Ge0.16 epilayer. However, high temperature (900 oC) furnace annealing for 1h prompted the strain in Si0.84Ge0.16 layer to relax.

StrainSi/SiGe heterostructureRutherford backscattering/Channeling (RBS/C)X-ray diffraction
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