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1.CAS Key Laboratory of Geospace Environment, Department of Plasma Physics and Fusion Engineering, University of Science and Technology of China, Hefei 230026, China
2.Laser Fusion Research Center, CAEP, P. O. Box 919 986, Mianyang 621900, China
3.The Sciences and Technology on Plasma Physics Laboratory, CAEP, Mianyang 621900, China
4.Institute of Fundamental and Frontier Sciences, University of Electronic Science and Technology of China, Chengdu 610054, China
5.Department of Nuclear, Plasma, and Radiological Engineering, University of Illinois at Urbana-Champaign, 104 South Wright Street, Urbana, IL 61801, USA
6.CAS Key Laboratory of Quantum Information, University of Science and Technology of China, Hefei 230026, China
7.IFSA Collaborative Innovation Center, Shanghai Jiao Tong University, Shanghai 200240, China
8.CAS Center for Excellence in Ultra-Intense Laser Science, Shanghai 201800, China
* binsun97@mail.ustc.edu.cn
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* jzheng@ustc.edu.cn
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* zhaozongqing99@gmail.com
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Published:2023-02,
Published Online:22 February 2023,
Received:24 June 2022,
Revised:04 November 2022,
Accepted:14 November 2022
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Cite this article
Bin Sun, Yang-Fan He, Ruo-Yun Luo, et al. On-chip stackable dielectric laser accelerator. [J]. Nuclear Science and Techniques 34(2):23(2023)
Bin Sun, Yang-Fan He, Ruo-Yun Luo, et al. On-chip stackable dielectric laser accelerator. [J]. Nuclear Science and Techniques 34(2):23(2023) DOI: 10.1007/s41365-023-01174-7.
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