EQR SiPM with P-on-N diode configuration

EQR SiPM with P-on-N diode configuration 1 first-author 1 1 corresp Correspondence: lk@bnu.edu.cn; Correspondence: lk@bnu.edu.cn; lk@bnu.edu.cn 1 1 Novel Device Laboratory, Beijing Normal University, Beijing 100875 China Novel Device Laboratory, Beijing Normal University, Beijing 100875 China The silicon photomultiplier (SiPM) with epitaxial quenching resistor (EQR) is an emerging and developing technology that has recently attracted the interest from the research community. It has characteristics of a continuous low-resistance cap layer and integrated quenching resisters in epitaxial silicon layer, which makes it possible to increase microcell density or reduce microcell size, thus obtain large dynamic range and high photon detection efficiency (PDE) simultaneously. Results published show that the EQR SiPM with N-on-P diode configuration had relatively low PDE at peak wavelength of 480nm as 16%. This paper reported the EQR SiPM with P-on-N diode configuration having active area of 3×3 mm 2 and cell density of 10000/mm 2 (total 90000 pixels). It was characterized with gain of 2E5, dark count rate of 7 MHz, crosstalk of 7%, dynamic range of 85000 pixels, overall recovery time of 32 ns at room temperature and over-voltage of 3.5 V. The improved PDE at peak wavelength of 420nm was 30%. Silicon photomultiplier Epitaxial quenching P-on-N diode Characteristics 1. Introduction 1 The silicon photomultiplier (SiPM) is a sensor that can detect weak light signals even on single photon level. Its key performance characteristics include: high photon detection efficiency (PDE), excellent resolution for single photon detection, insensitivity to magnetic field, low operating voltage and convenience for integration. SiPM is gradually replacing the traditional photomultiplier tube in various applications like high energy physics, astrophysics and nuclear medical imaging [ 1 1 - 3 3 1-3 ] . Most commercial SiPMs employ polysilicon or other materials to make quenching resistors. SiPM with bulk integrated quenching resistor is theoretically simulated by Semiconductor Laboratory of the Max-Planck-Society, which have some advantages like omission of polysilicon and its metal lines on top of device and the simplified production [ 4 4 ] . The epitaxial quenching resistor (EQR) SiPM have been developed by Novel Device Laboratory (NDL) [ 5 5 - 7 7 5-7 ] , which employ epitaxial substrate resistor instead of polysilicon resistor to connect avalanche photodiode (APD) cells. The EQR technology can be used to obtain high geometrical fill factor and high density of micro APD cells thus the EQR SiPM feature large dynamic range and high PDE simultaneously. The N-on-P type EQR SiPM with active area of 1×1 mm 2 and cell density of 21488/mm 2 had PDE equal to 16% at 480 nm in previous paper [ 8 8 ] . Compared with the N-on-P type device, the ionization coefficient of electron is much greater than holes, that electron from the top of device traveling into bulk has a greater probability to trigger the avalanche, thus the PDE of P-on-N type SiPM can be increased obviously [ 9 9 , 10 10 ] . More than that, the shallow p-n junction make the depletion region rather close to the surface also enhance PDE for the blue-violet light with short penetrating depth. This paper reported the PDE of P-on-N type EQR SiPM with active area of 3×3 mm 2 as 30% at 420nm. 2. Experiments 1 2.1 Device structure 2 As shown in Fig. 1 Fig. 1 , the P-on-N type EQR SiPM comprises of thousands of APD cells, each of which consists of N-enriched region forming high electric field between N-type epitaxial silicon wafer and P++ surface layer. The epitaxial region below P-on-N junction behaves as a quenching resistor. The APD cells are isolated from each other by the depletion regions. The avalanche signals from each cell are collected directly by the P++ surface layer that act as a common cathode. The SiPM was TO-5 encapsulated, which has the active area of 3×3 mm 2 and the cell size of 10 μm. 2.2. Characterizing Methods 2 As shown in Fig.2 (a) Fig.2 (a) , the device had been evaluated in a temperature controlled box to control the ambient temperature. In dark conditions, the pulse shape, dark count rate, the afterpulsing ratio and the crosstalk ratio were recorded and analyzed through the digital oscilloscope (LeCroy WaveRunner 640Zi). The PDE depending on wavelength was characterized using stochastic photon counting method that devices was irradiated with stochastic photons and PDE was quantitatively measured by considering the increased count rate for avalanche pulses when comparing with dark count rate [ 11 11 ] . As shown in Fig.2 (b) Fig.2 (b) , an integrating sphere with three ports has been used. The incident light port was connected with Xenon lamp and monochromator (Zolix LSH-X 150) through optical fiber; the other ports were cling to monitoring PIN photodiode and SiPM. The events detected from SiPM were counted by the oscilloscope (Tektronix TDS 1012) and the monitoring current from PIN were collected by Keithley 237. PDE is calculated by the following formula [ 12 12 ] : <math display="block" id="M1"><mrow><mi>P</mi><mi>D</mi><mi>E</mi><mo>=</mo><mfrac><mrow><mi>C</mi><mi>R</mi><mo>−</mo><mi>D</mi><mi>C</mi><mi>R</mi><mo>×</mo><msub><mi>R</mi><mrow><mtext>PIN</mtext></mrow></msub><mo>×</mo><mi>h</mi><mo>×</mo><mi>c</mi></mrow><mrow><mrow><mo>(</mo><mrow><msub><mi>I</mi><mrow><mtext>total</mtext></mrow></msub><mo>−</mo><msub><mi>I</mi><mrow><mtext>dark</mtext></mrow></msub></mrow><mo>)</mo></mrow><mo>×</mo><mi>λ</mi></mrow></mfrac><mo>×</mo><mfrac><mrow><msub><mi>A</mi><mrow><mtext>PIN</mtext></mrow></msub></mrow><mrow><msub><mi>A</mi><mrow><mtext>SiPM</mtext></mrow></msub></mrow></mfrac><mo>×</mo><mn>100</mn><mi>%</mi><mo>,</mo></mrow></math> where, DCR is dark count rate and CR is photon counting rate of SiPM over 0.5 p.e. threshold; h represents Planck constant, c represents vacuum light speed and λ represents wavelength; R PIN is spectral responsivity, I total is photocurrent and I dark is dark current of PIN; A SiPM and A PIN are active areas of SiPM and PIN respectively. Dynamic range measurement has been shown in Fig.2 (c) Fig.2 (c) . The pulse light from OYSL-Photonics SC-Pro source (peak wavelength~532nm, pulse width~100ps, frequency ~1MHz) was transmitted and attenuated. Under adjustable light intensity, the dynamic range of SiPM was calibrated accurately by considering the multiple photons response pulse area over single photon pulse area. Under low light intensity, the pulse area distribution spectrum can be characterized. 3. Results and Discussion 1 3.1. I-V Characteristics 2 We present the I-V characteristics of P-on-N type EQR SiPM with active area of 3×3 mm 2 . As shown in Fig. 3 Fig. 3 , at room temperature the breakdown voltage (V b ) is 23V and the leakage current is about 0.01nA. The voltage at the second inflexion point in the I-V curve is 28V. Thus the maximum allowable over-voltage (ΔDV) reaches 5 V. 3.2. Dark Count and Crosstalk 2 The rate of counts in dark conditions caused by thermally generated electrons in the active volume of silicon is usually regarded as the primary source of noise. Its secondary pulse crosstalk (CT) and the afterpulsing affect the signal-to-noise ratio of SiPM, which is supposed to be reduced. Employing the resistance capacitance filter circuit and Keithley 237 bias source, the dark count rate (DCR) were observed directly through the oscilloscope. The ratio of DCR over two threshold level could be obtained as the crosstalk probability (CT=DCR 1.5p.e. /DCR 0.5 p.e ). As shown in Fig.4 Fig.4 , the CT and DCR both depend on over-voltage. At room temperature, under 3.5V over-voltage, the DCR of P-on-N type EQR SiPM with 3×3 mm 2 active area is 7MHz and the CT is below 7%. 3.3. Temperature Related Properties 2 Dependence of the V b and the DCR on temperature were characterized in Fig.5 Fig.5 . The V b increase linearly with temperature, which had coefficient of 19 mV/℃ that was comparatively low temperature coefficient [ 13 13 ] . Due to increasing ionization rates at low temperature, APD cells having higher probability to trigger avalanche make V b decreases subsequently [ 14 14 ] . The DCR mainly caused by thermal generation of electrons depending on the temperature and hence it can be reduced by cooling. In addition, the DCR can be effectively reduced by selecting the silicon substrate with few defects and by increasing the process reliability. 3.4. Photon detection efficiency 2 Figure 6 Figure 6 display the PDE spectra for device under different over-voltage at room temperature. The PDE increase with the over-voltage (less than 3.5V) and the peak PDE reach over 30% at wavelength of 420 nm. We didn’t observe significant rise of the peak PDE beyond the over-voltage of 3.5 V, which indicates that the Geiger probability was probably reaching the maximum value and the DCR was too high to evaluate the PDE correctly. For the EQR SiPM with P-on-N configuration, the triggering probability of electrons are higher than that of holes and the depletion region close to the surface benefits to detecting the blue-violet light with short penetrating depth. In applications such as Positron Emission Tomography (PET), a high sensitivity at blue and violet wavelength band is desirable due to presence of the emission spectrum of common PET scintillator (Lutetium Orthosilicate (LSO) or Lutetium-Yttrium Orthosilicate (LYSO)) peak in this part of the spectrum [ 15 15 ] . The P-on-N type EQR SiPM with improved blue-light detection is supposed to be used in these applications. 3.5. Dynamic range 2 The theoretical relationship between number of excited cells and photon numbers of a photo response pulse can be described by formula [ 16 16 ] : <math display="block" id="M2"><mrow><msub><mi>N</mi><mrow><mtext>fired</mtext></mrow></msub><mo>=</mo><msub><mi>N</mi><mrow><mtext>total</mtext></mrow></msub><mrow><mo>(</mo><mrow><mn>1</mn><mo>−</mo><mi>exp</mi><mrow><mo>(</mo><mrow><mfrac><mrow><mo>−</mo><msub><mi>N</mi><mrow><mtext>photon</mtext></mrow></msub><mo>×</mo><mi>P</mi><mi>D</mi><mi>E</mi></mrow><mrow><msub><mi>N</mi><mrow><mtext>total</mtext></mrow></msub></mrow></mfrac></mrow><mo>)</mo></mrow></mrow><mo>)</mo></mrow><mo>,</mo></mrow></math> where N photon represents the number of incident photons, N total represents the number of total pixels in SiPM and N fired represents the number of fired pixels. We investigate P-on-N type EQR SiPM with pixel size of 10 μm and 90000 pixels. As shown in Fig. 7 Fig. 7 , the N fired increase monotonously with the N photon . The N fired reached to its maximum value of 85000 pixels that is very close to N total (90000 pixels). The experimental results were slightly different from the theoretical results due to abnormality in micro cells. The device shows a high dynamic range that can meet most requirements for radiation detections. 3.6. Pulse area distribution 2 As shown in Fig. 8(a) Fig. 8(a) , single photoelectron peaks could be distinguish clearly that confirms good single photon resolution and uniformity for gain. The gain was calculated from the charge number of a single photon response pulse through digital oscilloscope [ 8 8 ] . Fig. 8(b) Fig. 8(b) displayed the gain depending on over-voltage. Under over-voltage of 3.5V, the EQR SiPM had gain value as high as 2.24×10 5 that was equivalent to most of PMT. 3.7. Recovery time 2 The time needed to recharge a pixel after a breakdown which has been quenched due to the finite time taken to quench the avalanche and then to reset the diode voltage to its initial bias value is defined as the recovery time [ 17 17 ] . The recovery time of EQR SiPM has been characterized using double light pulse method. As shown in Fig. 9 Fig. 9 , the recovery time reach 31.1±1.8 ns when total pixels were fired. The recovery time of one APD cell was 3.1 ns [ 18 18 ] . The recovery time of EQR SiPM decreased with the reducing number of fired pixels. It mainly due to the influence of capacitance and resistance at readout circuit, time delay caused by transmission line. The investigation reveals that the recovery time can be shorten to decrease the operating voltages and to reduce the number of fired cells. Optimization of the surface signal collection electrode would be a feasible solution. 4. Summary 1 We have reported the EQR SiPM with P-on-N type diode configuration. 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Instruments . 1 , 5 ( 2017 ). doi: 10.3390/instruments1010005 http://doi.org/10.3390/instruments1010005 Recovery time of silicon photomultiplier with epitaxial quenching resistors The authors would like to thank Baicheng Li, for helping PDE measurement, Hesheng Tan and Rongdan Liu for device simulation 10.1007/s41365-019-0644-9 This work was supported by the National Natural Science Fundation of China (Nos. 61534005, 11475025 and 11375029). 2017-07-19 2019-01-28 2019-05-09 2019-07-11 2019-08-01 2021-04-11 © China Science Publishing & Media Ltd. (Science Press), Shanghai Institute of Applied Physics, the Chinese Academy of Sciences, ChineseNuclear Society and Springer Nature Singapore Pte Ltd. 2019 This is a post-peer-review, pre-copyedit version of an article published in Nuclear Science and Techniques. The final authenticated version is available online at: http://dx.doi.org/10.1007/s41365-019-0644-9 http://dx.doi.org/10.1007/s41365-019-0644-9 . 2019 Nuclear Science and Techniques 08 30