The relations of variation of lattice stress to shape, peak concentrations of the P atom depth profile and Sb doses of P+Sb dual implantation were studied in high energy P implantation silicon. The experimental results show that the lattice stress in P-implanted silicon obviously increases with increasing ion dose. The stress of P-implanted silicon with the dose of 2×1013/cm2 is 2.2 times greater than at a dose of 3.6×1012/cm2. The stress decreases rapidly as the annealing time increases. It is very interesting that the stress has a negative value when the concentration of P atoms in the implanted layer is below 6×1016/cm3, whereas the stress becomes positive when the concentration is greater than 6×1016/cm3. The stress increases rapidly with increasing Sb ion dose after P implantation. The stress has a positive value before annealing. If the Sb dose is below 1×1016/cm2, the stress is negative after annealing, and it is positive when the Sb dose is higher than 1×1016/cm2. The stress is close to zero for a Sb implantation dose of 1×1016/cm2. The best compensation dose of Sb to P implantation dose of 3×1016/cm2 is 1×1016/cm2.
Silicon lattice stressP+ and P+Sb implantationRapid thermal annealingReduction and compensation
